전력전달 및 분배 향상을 위한 Interconnect 공정 기술

• 영문명: Interconnect Process Technology for High Power Delivery and Distribution
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 오경환 마준성 김성동 김사라은경
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제3호, 9~14쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.09.30

영문 초록

Robust power delivery and distribution are considered one of the major challenges in electronic devices today. As a technology develops (i.e. frequency and complexity, increase and size decreases), both power density and power supply noise increase, and voltage supply margin decreases. In addition, thermal problem is induced due to high power and poor power distribution. Until now most of studies to improve power delivery and distribution have been focused on device circuit or system architecture designs. Interconnect process technologies to resolve power delivery issues have not greatly been explored so far, but recently it becomes of great interest as power increases and voltage specification decreases in a smaller chip size.

목차

1. 서론

2. 관련 연구

3. ABL 범프 공정설계

4. 요약

참고문헌

키워드

power delivery power distribution thermal management interconnect