PCB 및 패키징 공정에서의 도금 시뮬레이션 기술 적용

• 영문명: Application of Plating Simulation for PCB and Pakaging Process
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 이규환
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제3호, 1~7쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.09.30

영문 초록

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

목차

1. 서론

2. 전기도금과 도금두께분포

3. 도금 시뮬레이션 이론

4. 도금 시뮬레이션 적용 사례

5. 도금 시뮬레이션 기술의 한계 및 발전방안

6. 맺음말

감사의 글

참고문헌

키워드

electroplating plating simulation current distribution potential model thickness distribution