SAC305 및 나노 입자 분산 솔더의 특성

• 영문명: Characteristics of SAC305 and Nano-Particle Dispersed Solders
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 김장백 서성민 강혜준 조도훈 스리 하리니 라젠드란 정재필
• 간행물 정보: 『마이크로전자 및 패키징학회지』제28권 제1호, 31~37쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2021.03.31

영문 초록

Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanically and electrically. Thus, improvement of SAC305 solders have been investigated continuously by addition of alloying elements, nano-particles and etc. In this paper, recent improvements of SAC solders including nano-composite alloys and related solderabilty and metallurgical and mechanical properties are investigated.

목차

I. 서론

II. 리플로우 솔더링 공정

III. SAC305 및 나노 복합재의 융점

IV. 젖음성

V. 솔더 및 접합부의 미세 조직

VI. 인장강도 특성

VII. 결론

감사의 글

References

키워드

Sn-3wt%Ag-0.5wt%Cu solder nano-composite solder wetting microstructure tensile property