DIMM-in-a-PACKAGE Memory Device Technology for Mobile Applications

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: R. Crisp Crisp,R.
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제4호, 45~50쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.12.31

영문 초록

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the centerbonded devices (DDR3, DDR4 and LPDDR3 ×16 die) and for the face up wirebonded ×32 LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

목차

1. Introduction

2. Ball Assignment Design

3. Test Hardware Consolidation

4. System Design

5. Feasibility Study

6. Reference Design: SDP Memory With HDI(12 layer: 3-6-3) TYPE-4 PCB

7. Details: Comparison of Memory Footprint Layouts

8. Features and Versatility of Ballout

9. Conclusion

References

키워드

DRAM multi-die package ball assignment wire bonding system design