무연솔더 접합부 특성향상을 위한 나노복합솔더 기술

• 영문명: Nano-Composite Solder Technology for the Improvement of Solder Joint Properties
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 기원명 이영규 이창우 유세훈
• 간행물 정보: 『마이크로전자 및 패키징학회지』제18권 제3호, 9~17쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2011.09.30

영문 초록

Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, ZrO₂, TiB₂, etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance, low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.

목차

1. 서론

2. 나노복합솔더의 제조

3. 나노복합솔더의 특징

4. 나노복합솔더의 문제점 및 연구방향

5. 결론

감사의 글

참고문헌