활성금속 브레이징을 사용한 세라믹과 금속의 접합

• 영문명: Joining of Ceramic and Metal using Active Metal Brazing
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 기세호 허증봉 정재필 김원중
• 간행물 정보: 『마이크로전자 및 패키징학회지』제18권 제3호, 1~7쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2011.09.30

영문 초록

Active brazing of ceramic to metal is reviewed in this paper. As one of the key aspect in joint techniques, active brazing has been developed to simplify the manufacturing procedure of brazed joints between ceramic and metal. The active filler metal includes Ag-Cu-Ti series, Cu-Ti series, Co-Ti series and so on. The active filler metal which supplies the chemical bonds between ceramic and metal, enhances the wetting of filler metal on ceramic surface and eliminates the need for metallization treatments. The residual stress caused by difference of coefficient of thermal expansion between ceramic and metal, holds a direct influence on the bonding strength and even results in a fracture. Good joints of ceramic to metal promote the miniaturization and simplicity of electronic components with multifunction.

목차

1. 서론

2. 활성금속 브레이징 접합기술

3. 세라믹/금속 접합체에서의 잔류응력

4. 활성 금속 브레이징 기술의 동향

5. 결론

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