전도성 접착제를 이용한 패키징 기술

• 영문명: Recent Advances in Conductive Adhesives for Electronic Packaging Technology
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 김종웅 이영철 노보인 윤정원 정승부
• 간행물 정보: 『마이크로전자 및 패키징학회지』제16권 제2호, 1~9쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2009.06.30

영문 초록

Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental friendliness, finer pitch feasibility and lower temperature processing. This review focuses on the recent research trends on the reliability and property evaluation of anisotropic and non-conductive films that interconnect the integrated circuit component to the printed circuit board or other types of substrate. Major topics covered are the conduction mechanism in adhesive interconnects; mechanical reliability; thermo-mechanical-hygroscopic reliability and electrical performance of the adhesive joints. This review article is aimed at providing a better understanding of adhesive interconnects, their principles, performance and feasible applications.

목차

1. 서론

2. Conductive adhesives

3. Mechanical reliability

4. Thermo-medchanical-hygroscopic reliability

5. Electrical performance

6. 결론

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