High-Yield Etching-Free Transfer of Graphene: A Fracture Mechanics Approach

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Taeshik Yoon Woo Sung Jo Taek-Soo Kim Yoon,Taeshik Jo,Woo Sung Kim,Taek-Soo
• 간행물 정보: 『마이크로전자 및 패키징학회지』제21권 제2호, 59~64쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2014.06.30

영문 초록

Transfer is the critical issue of producing high-quality and scalable graphene electronic devices. However, conventional transfer processes require the removal of an underlying metal layer by wet etching process, which induces significant economic and environmental problems. We propose the etching-free mechanical releasing of graphene using polymer adhesives. A fracture mechanics approach was introduced to understand the releasing mechanism and ensure highyield process. It is shown that the thickness of adhesive and target substrate affect the transferability of graphene. Based on experimental and fracture mechanics simulation results, we further observed that compliant adhesives can reduce the adhesive stress during the transfer, which also enhances the success probability of graphene transfer.

목차

1. Introduction

2. Experimental

3. Results and Discussion

4. Conclusions

Acknowledgments

References

키워드

Graphene Transfer Etching-Free Fracture