Wetting Balance Test를 이용한 솔더의 젖음성 분석

• 영문명: Wettability Analysis of Solders using Wetting Balance Test
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 정도현 임동욱 백범규 임송희 윤종혁 정재필
• 간행물 정보: 『마이크로전자 및 패키징학회지』제24권 제2호, 1~9쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2017.06.30

영문 초록

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

목차

1. 서론

2. Wetting Balance Test의 원리 및 방법

3. 젖음곡선(Wetting Curve)의 해석

4. 젖음력(wetting force)의 해석

5. 젖음성(wettability) 평가

6. 결론

감사의 글

References

키워드

wetting balance test soldering wettability surface tension miniaturization