전력 무결성을 위한 온 칩 디커플링 커패시터

• 영문명: On-chip Decoupling Capacitor for Power Integrity
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 조승범 김사라은경
• 간행물 정보: 『마이크로전자 및 패키징학회지』제24권 제3호, 1~6쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2017.09.30

영문 초록

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

목차

1. 서론

2. 온 칩 디커플링 커패시터 종류

3. 박막 디커플링 커패시터

4. 3D 패키징 응용

5. 결론

감사의 글

References

키워드

Decoupling capacitor Power integrity Power network management Passive devices Dielectric constant