UV Laser Cutting Process for FPCB

• 영문명: UV Laser Cutting Process for FPCB
• 발행기관: 한국레이저가공학회
• 저자명: 신동식(Dongsig Shin) 이제훈(Jahoon Lee) 정용운(Yongwoon Chung) 손현기(Hyonkee Shon)
• 간행물 정보: 『한국레이저가공학회 학술대회 논문집』2007년도 추계학술발표대회 논문집, 103~111쪽, 전체 9쪽
• 주제분류: 공학 > 기계공학
• 파일형태: PDF
• 발행일자: 2007.11.30

영문 초록

  The application of lasers in the area of microelectronics is growing and diversifying to innovative technologies to enable the increased sophistication of their products. Lasers are employed in manufacturing processes as varied as semiconductor lithography, wafer dicing, and micro-welding via drilling and FPCB cutting. In particular, the laser ablation process is required in sophisticated FPCB cutting as the prior punching process incurs shearing and scratching. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser and adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Using an alpha-stepper, it was possible to analyze the thermal effect, composition of the surface debris, and the ablation rate. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining. Finally, useful data will result for the cutting of elaborately designed FPCBs for portable devices such as laptops, PDAs and mobile phones.

목차

ABSTRACT
1. 서론
2. 실험방법
3. 실험결과 및 고찰
4. 결론
후기
5. 참고문헌

키워드

Laser(레이저) FPCB(연성회로기판) MHS process(고속반복가공) SLS process(저속단일가공)