Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating

• 영문명: Insulated, Passivated and Adhesively-Promoted Bonding Wire using Al2O3 Nano Coating
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Soojae Park Eunmin Cho Myoungsik Baek Eulgi Min Kyujung Choi
• 간행물 정보: 『마이크로전자 및 패키징학회지』제31권 제2호, 1~8쪽, 전체 8쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2024.06.30

국문 초록

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al2O3 passivation.

목차

1. Introduction

2. Experiments & Results

3. Conclusions

References

키워드

Insulated wire Adhesively-promoted wire Passivated wire Al2O3 coating Bonding wire Nano ceramic