광 PCB 및 패키징 기술

• 영문명: Optical PCB and Packaging Technology
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 류진화 김동민 김응수 정명영
• 간행물 정보: 『마이크로전자 및 패키징학회지』제18권 제1호, 7~13쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2011.03.31

영문 초록

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.

목차

1. 서론

2. 광 PCB 연구개발 동향

3. 광 PCB 패키징 기술

4. 향후 전망

감사의 글

참고문헌