Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages

• 영문명: Mechanical Tenacity Analysis of Moisture Barrier Bags for Semiconductor Packages
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Kim, Keun-Soo Kim, Tae-Seong Min Yoo Yoo, Hee-Yeoul
• 간행물 정보: 『마이크로전자 및 패키징학회지』제11권 제1호, 43~47쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2004.03.31

영문 초록

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

목차

Introduction

Experiment

Results and discussion

Conclusion

References

키워드

Moisture barrier bag Mechanical tenacity Puncture Pin hole Dry packing Drop test