Failure Paths Analyses of the Leadframe/EMC System

• 영문명: Failure Paths Analyses of the Leadframe/EMC System
• 발행기관: 한국마이크로전자및패키징학회
• 간행물 정보: 『마이크로전자 및 패키징학회지』제7권 제2호, 7~12쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2000.06.30

영문 초록

Copper-based leadframe sheets were oxidized in a black-oxide forming solution, and molded with epoxy molding compound (EMC) to form sandwiched double-cantilever beam (SDCB) specimens. The adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using SDCB specimens and the fracture surfaces were analyzed by various equipments such as glancing-angle XRD, AFM, and SEM. Results showed that three types of failure paths, which were closely related to the surface condition of leadframes before molding.

목차

1. Introduction

2. Experimental Procedure

3. Results and Discussion

4. Conclusions

References