효율적 수치해석기법을 이용한 반도체 페키지의 열방출 해석

• 영문명: Efficient Approach to Thermal Modeling for IC Packages
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Seung Mo Kim Choon Heung Lee
• 간행물 정보: 『마이크로전자 및 패키징학회지』제6권 제2호, 31~36쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 1999.06.30

영문 초록

An efficient method for thermal modeling of QFP is Proposed. Thermal measurement data are given to verify the method. In parallel with the experiment, an exact full 3-D model calculation is also provided. One fonds that there is an excellent agreement between validation data and the efficient model data.

목차

1. INTRODUCTION

2. Modeling Analysis

3. Simplified approach to the modeling

4. Thermal Test Procedure

5. Results and Discussions

6. Acknowledgements

REFERENCES