Adhesion Strength Measurements of Cu-based Leadframe/EMC Interface

• 영문명: Adhesion Strength Measurements of Cu-based Leadframe/EMC Interface
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Lee, Ho-Young Jin Yu
• 간행물 정보: 『마이크로전자 및 패키징학회지』제6권 제2호, 1~12쪽, 전체 12쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 1999.06.30

영문 초록

Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted Cu₂O on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

목차

1. INTRODUCTION

2. EXPERIMENTAL PROCEDURE

3. RESULTS AND DISCUSSION

4. CONCLUSIONS

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