Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Shingo NISHIKI
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제4호, 39~43쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.12.31

영문 초록

Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.

목차

1. Introduction

2. Contribution of Additives in Acid Copper Plating

3. Influence of Increase Current Density in Conventional Bath

4. Importance of Leveler for Via-filling and Through-hole Plating

5. TOP LUCINA HV

6. TOP LUCINA HT

7. Conclusion

References

키워드

Acid Copper Plating Additives Via-Filling Plating Through-Hole Plating Leveler Productivity Improvement