광 패키징 및 인터커넥션 기술

• 영문명: Optical Packaging and Interconnection Technology
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 김동민 류진화 정명영
• 간행물 정보: 『마이크로전자 및 패키징학회지』제19권 제4호, 13~18쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2012.12.31

영문 초록

By the need for high-speed data transmission in PCB, the studies on the optical PCB has been conducted with optical interconnection and its packaging technology. Particularly, the polymer-based optical interconnection has been extensively studied with the advantages such as cost-effective and ease of process. For high-efficiency and passive alignment, the studies were performed using the 45 degree mirrors, MT connector, and etc. In this work, integrated PLC device and fiber alignment array block was fabricated by using imprint technology to solve the alignment and array problem of optical device and the optical fiber. The fabricated integrated block for optical interconnection of PLC device has achieved higher precision of decreasing the dimensional error of the patterns by optimization of process and its insertion loss has an average value of 4.03dB, lower than criteria specified by international standard. In addition, a optical waveguide with built-in lens has been proposed for high-efficiency and passive alignment. By simulation, it was confirmed that the proposed structure has higher coupling efficiency than conventional no-lens structure and has the broad tolerance for the spatial offset of optical waveguide.

목차

1. 서론

2. 고분자 광도파로를 이용한 광 인터커넥션 및 패키징 기술동향

3. 고효율, 고정밀도, 수동정렬을 위한 광인터커넥션 및 패키징 기술

4. 향후 전망

감사의 글

참고문헌

키워드

Optical PCB Optical interconnection PLC Fiber array Built-in lens