Study on the Nonlinear Characteristic Effects of Dielectric on Warpage of Flip Chip BGA Substrate

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Seunghyun Cho
• 간행물 정보: 『마이크로전자 및 패키징학회지』제20권 제2호, 33~38쪽, 전체 6쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2013.06.30

영문 초록

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of nonsymmetric structure with body size of 22.5×22.5 mm, 37.5×37.5 mm and 42.5×42.5 mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

목차

1. Introduction

2. Finite Element analysis

3. Results and Discussions

4. Conclusions

Acknowledgments

References

키워드

Nonlinear behavior dielectric warpage FCBGA substrate FEM