Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Ashutosh Sharma Jae-Pil Jung
• 간행물 정보: 『마이크로전자 및 패키징학회지』제22권 제4호, 1~5쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2015.12.31

영문 초록

In high temperature aircraft electronics, aluminium based brazing filler is the prime choice today. Aluminium and its alloys have compatible properties like weight minimization, thermal conductivity, heat dissipation, high temperature precipitation hardening etc. suitable for the aerospace industry. However, the selection of brazing filler for high temperature electronics requires high temperature joint strength properties which is crucial for the aerospace. Thus the selection of proper brazing alloy material, the composition and brazing method play an important role in deciding the final reliability of aircraft electronic components. The composition of these aluminium alloys dependent on the addition of the various elements in the aluminium matrix. The complex shapes of aluminium structures like enclosures, heat dissipaters, chassis for electronic circuitry, in avionics are designed from numerous individual components and joined thereafter. In various aircraft applications, the poor strength caused by the casting and shrinkage defects is undesirable. In this report the effect of various additional elements on Al based alloys and brazing fillers have been discussed.

목차

1. Introduction

2. Classification of Al Alloys

3. Alloying Additions in Al Based Alloys and Fillers

4. Conclusion

Acknowledgements

References

키워드

Aluminium alloys brazing strength electronics porosity