그래핀을 이용한 전자패키징 기술 연구 동향

• 영문명: Trends of Researches and Technologies of Electronic Packaging Using Graphene
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 고용호 최경곤 김상우 유동열 방정환 김택수
• 간행물 정보: 『마이크로전자 및 패키징학회지』제23권 제2호, 1~10쪽, 전체 10쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2016.06.30

영문 초록

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

목차

1. 서론

2. Graphene 응용 전자패키징 기술

3. 결론

감사의 글

References

키워드

Electronic packaging Graphene Electronic system Pb-free Reliability