전력반도체 패키징을 위한 Transient liquid phase 접합 기술

• 영문명: Trasient Liquid Phase bonding for Power Semiconductor
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 노명훈 Hiroshi Nishikawa 정재필 김원중
• 간행물 정보: 『마이크로전자 및 패키징학회지』제24권 제1호, 27~34쪽, 전체 8쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2017.03.31

영문 초록

Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

목차

1. 서론

2. TLP 접합

3. 분말을 이용한 TLP 접합

4. 결론

감사의 글

References

키워드

Power semiconductor Pb-free TLP bonding shear strength mcirostructure