고온동작소자의 패키징을 위한 천이액상확산접합 기술

• 영문명: Transient Liquid Phase (TLP) Bonding of Device for High Temperature Operation
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 정도현 노명환 이준형 김경흠 정재필
• 간행물 정보: 『마이크로전자 및 패키징학회지』제24권 제1호, 17~25쪽, 전체 9쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2017.03.31

영문 초록

Recently, research and application for a power module have been actively studied according to the increasing demand for the production of vehicles, smartphones and semiconductor devices. The power modules based on the transient liquid phase (TLP) technology for bonding of power semiconductor devices have been introduced in this paper. The TLP bonding has been widely used in semiconductor packaging industry due to inhibiting conventional Pb-base solder by the regulation of end of life vehicle (ELV) and restriction of hazardous substances (RoHS). In TLP bonding, the melting temperature of a joint layer becomes higher than bonding temperature and it is cost-effective technology than conventional Ag sintering process. In this paper, a variety of TLP bonding technologies and their characteristics for bonding of power module have been described.

목차

1. 서론

2. TLP 접합

3. 결론

감사의 글

References

키워드

power module power semiconductor transient liquid phase (TLP) bonding Pb-free solder High temperature operation