파워모듈의 TLP 접합 및 와이어 본딩

• 영문명: TLP and Wire Bonding for Power Module
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 강혜준 정재필
• 간행물 정보: 『마이크로전자 및 패키징학회지』제26권 제4호, 7~13쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2019.12.31

영문 초록

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

목차

1. 서론

2. TLP Bonding

3. Wire Bonding

4. 결론

감사의 글

References

키워드

power module TLP bonding wire bonding electronics packaging