Ultra-Wide-Band (UWB) Band-Pass-Filter for Wireless Applications from Silicon Integrated Passive Device (IPD) Technology

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Lee, Yong-Taek Liu, Kai Frye, Robert Kim, Hyun-Tai Kim, Gwang Aho, Billy
• 간행물 정보: 『마이크로전자 및 패키징학회지』제18권 제1호, 41~47쪽, 전체 7쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2011.03.31

영문 초록

Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size (1.4mm×1.2mm×0.40mm) while achieving equivalent electrical performance.

목차

1. Introduction

2. IPD Description

4. Conclusions

Acknowledgments

References

키워드

Integrated Passive Device (IPD) Ultra Wide Band (UWB) Chip Scale Module Package Flip-chip Wire-bonding