Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance

• 발행기관: 한국마이크로전자및패키징학회
• 저자명: Dong-Young Jang Hyo-Sok Ahn Sajadieh.S.M.Mehdi Young-Hwan Lim Seok-Kee Hong
• 간행물 정보: 『마이크로전자 및 패키징학회지』제17권 제2호, 29~33쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2010.06.30

영문 초록

Among several critical topics in semiconductor fabrication technology, particles in addition to bonded surface contaminations are issues of great concerns. This study reports the development of a system which inspects wafer bond integrity by analyzing laser beam transmittance deviations and the variations of the intensity caused by the defect thickness. Since the speckling phenomenon exists inherently as long as the laser is used as an optical source and it degrades the inspection accuracy, speckle contrast is another obstacle to be conquered in this system. Consequently speckle contrast reduction methods were reviewed and among the all remedies have been established in the past 30 years the most adaptable solution for inline inspection system is applied. Simulation and subsequently design of experiments has been utilized to discover the best solution to improve irradiance distribution and detection accuracy. Comparison between simulation and experimental results has been done and it confirms an outstanding detection accuracy achievement. Bonded wafer inspection system has been developed and it is ready to be implemented in FAB in the near future.

목차

1. Introduction

2. Inspection System concept

3. Simulation

4. Screening

5. Optimization

6. Speckle Contrast Reduction

7. Result

8. Conclusion

Acknowledgment

References

키워드

Bonding wafer inspection Optimization Simulation Speckle reduction