유연/신축성 전자패키징 용 폴리머 재료의 기계적 물성 측정 기술 리뷰

• 영문명: Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging
• 발행기관: 한국마이크로전자및패키징학회
• 저자명: 김철규 이태익 김택수
• 간행물 정보: 『마이크로전자 및 패키징학회지』제23권 제2호, 19~28쪽, 전체 10쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2016.06.30

영문 초록

This paper presents an overview of selected advanced measurement technologies for the mechanical properties of polymers used for flexible and stretchable electronic packaging. Over the years, a variety of flexible and stretchable electronics have been developed due to their potential applications for next generation IT industry. To achieve more flexible and wearable devices for practical applications, the usage of polymeric components has been increased significantly. Therefore, accurate measurement of mechanical properties of the polymers is necessary in order to design mechanically reliable devices. However, the measurement has been challenging due to the soft nature and thin applications of polymers. Here, we describe novel measurement technologies of mechanical properties of polymers for flexible and stretchable electronics.

목차

1. 서론

2. 폴리머 재료의 비접촉식 열팽창계수 측정

3. 초박형 폴리머 필름의 인장 물성 측정

4. 유연 FR4 기판의 굽힘 탄성계수 측정

5. 결론

감사의 글

References

키워드

Flexible electronics Stretchable electronics Polymer Mechanical properties Measurement technology