광택Ni 도금액 중 비 전도성 차폐판을 이용한 도금두께 편차 감소에 관한 연구

• 영문명: A Study on the Uniformity of Plating Thickness of Ni-Plating using Insulating Plate
• 발행기관: 한국산업기술융합학회(구. 산업기술교육훈련학회)
• 저자명: 황환일(Hwan-Il Hwang)
• 간행물 정보: 『한국산업기술융합학회 학술대회 논문집』2011년 후반기 학술대회 논문집, 23~27쪽, 전체 5쪽
• 주제분류: 공학 > 산업공학
• 파일형태: PDF
• 발행일자: 2011.11.17

영문 초록

In this study, the effect of insulating plate on plating thickness of Ni-plating was investigated at the plating conditions of 10min of plating time, 5 or 10A/dm2 of current density, anode material of Ti Basket. The difference between maximum thickness and minimum thickness was 1.64㎛(2.14 times) at the current density of 5A/dm2, and without insulating plate. That is, the maximum thickness was 3.07㎛ and the minimum thickness was 1.43㎛. In the case of the current density of 10A/dm2, The difference was 2.91㎛(2.03 times). That is, the maximum thickness was 5.71㎛ and the minimum thickness was 2.80㎛. On the other hand, in the case of using insulating plate, The difference was 2.77㎛(1.99 times). That is, the maximum thickness was 5.56㎛ and the minimum thickness was 2.79㎛ at the current density of 5A/dm2 . And the difference was 2.98㎛(1.89 times)at the current density of 10A/dm2. That is, the maximum thickness was 6.30㎛ and the minimum thickness was 3.32㎛. These result means that using the insulating plate is an effective method for uniform plating thickness of Ni-plating.

키워드

Insulating Shied 차폐판 Plating Thickness Difference 도금두께 편차 Current Density 전류밀도 Anode Basket 양극 바스켓