217Plus™을 통한 전자 부품들의 고장률 산출

• 영문명: Failure rates of electronic parts through 217Plus™
• 발행기관: 강원대학교 산업기술연구소
• 저자명: 전태보(Jeon Tae Bo)
• 간행물 정보: 『산업기술연구』vol.28, 227~234쪽, 전체 8쪽
• 주제분류: 공학 > 공학일반
• 파일형태: PDF
• 발행일자: 2008.09.30

영문 초록

Reliability predictions for selected electronic parts using 217-Plus have been performed in this study. 217-Plus has recently developed and may be applied for electronics failure prediction as a surrogate of MIL-HDBK-217. We first briefly reviewed 217-Plus component models. Based on three selected components, predictions using both MIL-HDBK-217 and 217-Plus have been made and the results were compared. Even though the comprehensive conclusion may be drawn from extensive component and system level analyses, the results in this study may provide general insights towards reliability through two specifications.

목차

Abstract

1. 서론

2. MIL-HDBK-217 개요

3. 217-Plus의 개요

4. 고장률 산출

5. 결론

참고문헌

키워드

신뢰성예측 부품모형 reliability prediciction MIL-HDBK-217 217-Plus component models