노트북 PC용 히트파이프 냉각시스템의 성능에 관한 실험적 연구

• 영문명: An Experimental Study on Performance Test of Notebook PC’s Heat pipe Cooling System Model
• 발행기관: 호서대학교 공업기술연구소
• 저자명: 吳博均(Park-Kyoun Oh) 吳世珍(Se-Jin Oh)
• 간행물 정보: 『공업기술연구 논문집』제20권 제1호, 43~53쪽, 전체 11쪽
• 주제분류: 공학 > 제어계측공학
• 파일형태: PDF
• 발행일자: 2001.06.30

영문 초록

The increasing power and particularly the CPU power, coupled with the continuous shrinking size of current notebook PC, have made the thermal management one of the critical factors in the notebook PC design. The heat pipe has become a widely used thermal management tool in the notebook PC industry. Approximately 60% of current notebooks utilize heat pipe in their thermal management solutions. This paper provides a RHE，s(Remote Heat Exchanger) maximum heat transfer rate and the thermal resistance of heat pipe thickness changes and also bending or non-bending types. So, the discussions about the thermal discharge performances of RHE in the range of 1.6 ~ 2.0mm heat pipe thickness are pursued.

목차

i . 서 론

2. 실험장지 및 방법

3. 걸과 및 고찰

4. 결 론