레이저유도플라즈마분광분석법을 이용한 연성회로기판가공공정의 시간적 계측

• 영문명: Temporal process monitoring of flexible printed circuit board using laser induced breakdown spectroscopy
• 발행기관: 한국레이저가공학회
• 저자명: 류훈철(Hoonchul Ryoo) 김석(Seok Kim) 한재원(Jaewon Hahn)
• 간행물 정보: 『한국레이저가공학회 학술대회 논문집』2007년도 춘계학술발표대회 논문집, 119~129쪽, 전체 11쪽
• 주제분류: 공학 > 기계공학
• 파일형태: PDF
• 발행일자: 2007.06.30

영문 초록

  In the present study, the time evolution of laser induced plasma produced from single sided structure of flexible printed circuit board is characterized in terms of its temporally resolved spectral emissivity using the technique of laser induced breakdown spectroscopy. Using KrF excimer laser with the energy intensity of 82.6J/㎠, the temporal profiles of C₂ swan band from polyimide film and neutral copper from copper layer are studied for a time delay of 50㎱ from the beginning of the laser pulse under ambient pressure increasing by 200㎱. The measured decay times are 600.4㎱ and 486.4㎱ for C₂ swan band (516.5㎚) and neutral copper(521.8㎚) respectively. Finally, using the decay time data, the transition layer between polyimide and copper film is distinguished by their characteristic peak information with increased sensitivity.

목차

ABSTRACT
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2. 본론
3. 실험
4. 결과 및 고찰
5. 결론
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키워드

Flexible printed circuit board(연성회로기판) Laser induced breakdown spectroscopy(레이저 유도 플라즈마 분광법) Polyimide(폴리이미드) Copper(구리) KrF excimer laser(KrF 엑시머 레이저) Transition layer(가공 전이층)