친환경 레이저 디캡슐레이션에 관한 연구

• 영문명: Study of clean laser decapsulation process
• 발행기관: 한국레이저가공학회
• 저자명: 홍윤석 문성욱 남기중 최지훈 윤면근
• 간행물 정보: 『한국레이저가공학회 학술대회 논문집』2006년도 추계학술발표대회 논문집, 103~107쪽, 전체 5쪽
• 주제분류: 공학 > 기계공학
• 파일형태: PDF
• 발행일자: 2006.11.01

영문 초록

  Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It is confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

목차

ABSTRACT
1. 서론
2. 실험장치 및 방법
3. 실험결과 및 고찰
4. 결론
후기
참고문헌

키워드

decapsulation UV laser EMC laser material processing