디스플레이 모듈에서의 레이저 COG 접합 공정에 관한 연구

• 영문명: Study of a laser Chip on Glass bonding process for display module
• 발행기관: 한국레이저가공학회
• 저자명: 류광현(Kwang-hyun Ryu) 서명희(Myeong-hee Seo) 남기중(Gi-jung Nam) 곽노흥(No-Heung Kwak)
• 간행물 정보: 『한국레이저가공학회 학술대회 논문집』2006년도 추계학술발표대회 논문집, 85~89쪽, 전체 5쪽
• 주제분류: 공학 > 기계공학
• 파일형태: PDF
• 발행일자: 2006.11.01

영문 초록

  A COG(Chip on Glass) bonding process that is one of display packaging technology and bonds between driver IC chip and a glass panel using ACF(Anisotropic Conductive Film)has been investigated by using diode laser. This method is possible to raise cure temperature of ACF within one second and can reduce the total process time for COG bonding by a conventional method such as a hot plate. Also we can get good pressure mark on the surface of electrodes and higher bonding strength than that by convention method. Results show that laser COG bonding can give low pressure bonding and decrease a warpage of panel. We believe that it can be applied to fine pitch module.

목차

ABSTRACT
1. 서론
2. 본론
3. 실험방법
4. 결과 및 고찰
5. 결론
6. 참고문헌

키워드

Chip on Glass(COG) bonding laser bonding Anisotropic Conductive Film(ACF) display module display packaging