- 영문명
- A Empirical Study on Electronization Factor of Payment Settlement Documents on Electronic Trade
- 발행기관
- 한국상품학회
- 저자명
- 최준호(Choi Jun-Ho)
- 간행물 정보
- 『상품학연구』제23권 제2호, 53~80쪽, 전체 28쪽
- 주제분류
- 경제경영 > 경영학
- 파일형태
- 발행일자
- 2005.08.01

국문 초록
영문 초록
This study is a empirical study for electronization factor of Letter of Credit settlement documents acquired data from survey analyzed through SPSS program.
The purpose of this study is to analyze electronization factor Letter of Credit settlement documents so that imports and exports companies to utilize electronic documents with high proportion in a Letter of Credit settlement.
To summarize conclusions of this study, it will include the followings;
First, Electronization of Letter of Credit settlement documents is continuously raised by increase of electronic trade, and the imports and exports companies still using existing Letter of Credit settlement document method also have high interest about electronization of it.
Second, Imports and exports Companies using electronic Letter of Credit settlement documents as E-mail, Bolero.net, applying eUCP without depending on SWIFT system or EDI method can make retrenchment in expenses for company development and in business management cost, labor cost, document costs.
Third. Convenient work procedure could be achieved in imports and exports companies as shortening the procedures by applying electronization of Letter of Credit settlement documents in trade business.
목차
Ⅰ. 서론
Ⅱ. 신용장 결제서류의 전자화에 관한 이론적 고찰
Ⅲ. 연구의 설계
Ⅳ. 제4장 연구의 가설검증과 결과 분석
Ⅴ. 결론
참고문헌
Summary
키워드
해당간행물 수록 논문
참고문헌
최근 이용한 논문
교보eBook 첫 방문을 환영 합니다!
신규가입 혜택 지급이 완료 되었습니다.
바로 사용 가능한 교보e캐시 1,000원 (유효기간 7일)
지금 바로 교보eBook의 다양한 콘텐츠를 이용해 보세요!
