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반도체의 부가가치를 올리는 패키지와 테스트

서민석 지음
한올출판사

2020년 03월 30일 출간

종이책 : 2020년 03월 10일 출간

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이 책은 반도체 패키지와 테스트의 입문서입니다. 반도체 업계에 입문하려는 학생들에게는 방향을 제시하는 지침서의 역할을 하 게 될 것입니다. 또한 패키지와 테스트 관련 업무에 종사하는 분들과 유관 업무를 하고 계신 분 들에게는 이해도를 향상시켜드리게 될 것입니다. 나아가 패키지, 테스트의 장비와 소재를 만드는 분들에게도 이 책의 지식들이 해 당 업무의 효율을 높이는 데 기여할 것이라 생각됩니다.

제1장에서는 테스트 장비와 프로세스, 대략적인 테스트 항목에 대해 설명하였고, 제2장에서는 패키지의 정의와 역할, 기술 개발 트렌드, 기술 개발 프로세스 등을 설 명하였습니다. 제3장에서는 패키지의 종류를 분류하고, 각 종류별 특징, 장단점 등을 기술하였습니다. 제4장에서는 패키지 설계와 해석을 설명하였는데, 패키지 설계와 칩 설계의 차이점을 알리고, 설계 및 공정 효율을 높이기 위한 구조, 열, 전기 해석 내용과 과정 을 소개하였습니다. 제5장은 패키지 공정을 설명하는 장인데, 종류별 공정 순서와 각 공정들의 진행방 법과 의미를 소개하였습니다. 제6장에서는 패키지 공정 진행을 위해서 사용되는 재료들을 소개하였고, 제7장에서는 품질과 신뢰성의 의미 및 신뢰성 평가 항목들의 진행 방법과 목적을 설명하였습니다.
01 반도체

테스트의 이해

01. 반도체 후공정 ······················································ 5
02. 테스트의 종류······················································ 8
03. 웨이퍼 테스트 ···················································· 10
EPM ································································ 13
웨이퍼 번인······················································· 13
테스트 ····························································· 14
리페어······························································ 15

04. 패키지 테스트 ···················································· 16

TDBI································································ 17
테스트 ····························································· 18
외관 검사·························································· 18

02 반도체
패키지의 정의와 역할

01. 반도체 패키지의 정의········································· 25

02. 반도체 패키지의 역할 ········································ 26

03. 반도체 패키지의 개발 트렌드····························· 28

04. 반도체 패키지 개발 과정 ··································· 31

03 반도체

패키지의 종류

01. 반도체 패키지의 분류······················································ 39

02. 컨벤셔널 패키지·······························································41

플라스틱 패키지 - 리드프레임 타입 패키지··························41
플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43
세라믹 패키지 ································································ 46

03. 웨이퍼 레벨 패키지························································· 47

웨이퍼 레벨 패키지 ························································· 47
재배선··········································································· 56
플립 칩·········································································· 58

04. 적층 패키지····································································· 66

패키지 적층 ··································································· 67
칩 적층 - Chip Stack with Wire Bonding··························· 70
실리콘 관통 전극 - Chip Stack with TSV ··························· 73

05. 시스템 인 패키지····························································· 86

04 반도체

패키지 설계와 해석

01. 반도체 패키지 설계 ························································· 97

02. 구조 해석······································································· 101

휨 해석········································································ 104
솔더 접합부 신뢰성 ······················································· 106
강도 해석····································································· 108

03. 열 해석 ·········································································· 109

04. 전기 해석 ······································································113

05 반도체
패키지 공정

01. 컨벤셔널 패키지 공정·······································123

백 그라인딩 ····················································124
웨이퍼 절단·····················································127
다이 어태치 ····················································131
인터커넥션······················································137
몰딩·······························································143
마킹·······························································144
트리밍 - 리드프레임·········································146
솔더 도금 - 리드프레임·····································147
성형 - 리드프레임············································147
솔더 볼 마운팅 - 서브스트레이트 ·······················148
싱귤레이션 - 서브스트레이트 ····························152

02. 웨이퍼 레벨 패키지 공정··································153

포토 공정 ·······················································156
스퍼터링 공정 ················································· 161
전해도금 공정 ·················································163
습식 공정 - PR 스트립과 금속 에칭 ····················166
팬인 WLCSP 공정············································167
솔더 볼 마운팅 공정·········································168
플립 칩 범프 공정 ············································169
재배선 공정 ····················································171
팬아웃 WLCSP 공정·········································172
실리콘 관통 전극 패키지 공정···························· 174

03. 검사와 측정······················································187

검사·······························································187
측정·······························································192

06 반도체
패키지 재료

01. 컨벤셔널 패키지 재료···················································· 208

리드프레임 ·································································· 208
서브스트레이트···························································· 210
접착제········································································· 217
에폭시 몰딩 컴파운드···················································· 222
솔더 ··········································································· 225
테이프········································································· 228
와이어 ········································································ 229
포장 재료 ···································································· 230

02. 웨이퍼 레벨 패키지 재료··············································· 231

포토 레지스트 ······························································ 231
도금 용액····································································· 234
PR 스트립퍼································································· 235
에천트········································································· 237
스퍼터 타깃 ································································· 238
언더필········································································· 238
캐리어와 접착제, 마운팅 테이프······································ 240

07 반도체
패키지 신뢰성

01. 신뢰성 의미 ··································································· 247

02. JEDEC 기준··································································· 248

03. 수명 신뢰성 시험··························································· 253

EFR ············································································ 253
HTOL ········································································· 254
LTOL ·········································································· 255
HTSL ·········································································· 256
LTSL··········································································· 257
Endurance ····················································· 257
Data Retention··············································· 258

04. 환경 신뢰성 시험·············································· 259

Preconditioning·············································· 259
TC ································································· 263
TS ································································· 268
THS······························································· 268
PCTP······························································269
UHAST ·························································· 270
HAST····························································· 271
HALT····························································· 272

05. 기계적 신뢰성 시험·········································· 273

충격································································274
진동······························································· 275
구부림 ··························································· 275
비틀림·····························································276

08 반도체
용어해설

용어해설·································································· 282

작가정보

저자(글) 서민석

저자 : 서민석
서민석 박사는 한국과학기술원 재료공학과에서 학사,석사 학위를 취득하였고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사학위를 취득하였다.

이후 SK하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여하였다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip Chip, Fan in WLCSP, TSV(HBM, 3DS, Wide IO)등의 Wafer Level Package 개발을 주관하였다.

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문장수집은 고객님들이 직접 선정한 책의 좋은 문장을 보여 주는 교보문고의 새로운 서비스 입니다. 교보eBook 앱에서 도서 열람 후 문장 하이라이트 하시면 직접 타이핑 하실 필요 없이 보다 편하게 남길 수 있습니다. 마음을 두드린 문장들을 기록하고 좋은 글귀들은 ‘좋아요’ 하여 모아보세요. 도서 문장과 무관한 내용 등록 시 별도 통보없이 삭제될 수 있습니다.
리워드 안내
  • 구매 후 90일 이내에 문장 수집 등록 시 e교환권 100원을 적립해 드립니다.
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구매 후 문장수집 작성 시, e교환권 100원 적립

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    리뷰작성
    • 구매 후 90일 이내 작성 시, e교환권 100원 (최초1회)
    • 리워드 제외 상품 : 마이 > 라이브러리 > Klover리뷰 > 리워드 안내 참고
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    문장수집 작성

    구매 후 90일 이내 작성 시, e교환권 100원 적립

    eBook 문장수집은 웹에서 직접 타이핑 가능하나, 모바일 앱에서 도서를 열람하여 문장을 드래그하시면 직접 타이핑 하실 필요 없이 보다 편하게 남길 수 있습니다.

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